TDS-Carbon Graphite Rigid Composite Felt(integral Forming) for Semiconductor

TDS-Carbon Graphite Rigid Composite Felt(integral Forming) for Semiconductor

Product Introduction

The “TDS Carbon Graphite Rigid Composite Felt (integral Forming)” represents a remarkable advancement in the realm of materials engineering, combining the advantages of both carbon matrix and short carbon fiber reinforcement. This unique composite material boasts a low density, making it exceptionally lightweight, yet it remains incredibly strong. Its high tensile strength is a testament to its robust construction, ensuring it can withstand the rigors of demanding applications.

With a low coefficient of thermal expansion, this composite material maintains its structural integrity even in the face of extreme temperature variations. Its exceptional friction performance and heat resistance are characteristics that set it apart in the field of materials engineering. In addition, it exhibits excellent impact resistance, further enhancing its suitability for challenging environments.

One of the key attributes of our TDS Carbon Graphite Rigid Composite Felt is its high dimensional stability. This means that it retains its shape and structural consistency even under the most demanding conditions, providing unparalleled precision in critical applications.

With its “integral forming” construction, this composite felt is engineered as a single, unified entity, ensuring uniformity and stability across the material’s entire structure. This level of precision and control is essential, particularly in high-tech industries like semiconductor manufacturing, where exacting standards are the norm.

Product Features

The shape can be customized, the density is well controlled, the machining  is good, and the purity is high

Product Application

Single crystal furnace, polycrystal furnace, semiconductor industry, can also be used in powder metallurgy industrial furnace, vacuum sintering furnace, etc.

Product Model:GTL-PZ/TZ

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